Let's learn about the topography of advanced semiconductor packaging components, materials, and equipment companies 00:00 Intro 00:07 Introduction of Jaedong Kim, a consultant in the semiconductor packaging field 01:09 Explanation of the concept, importance, and role of chiplet technology as a solution 02:59 Application cases and benefits of chiplet technology by major companies 09:03 Discussion of technical challenges, compatibility issues, and complexity of chiplet technology 16:00 Development direction of chiplet technology, economic feasibility and technical benefits of using small chips 23:17 Information on direct bonding technology, related equipment, and material suppliers 32:10 Importance of materials (underfill, TIM, etc.) used in packaging processes and application methods 41:02 Future of semiconductor packaging processes, ways to strengthen competitiveness of Korean companies, and discussion of challenges and opportunities #JaedongKim #SemiconductorPackaging #Semiconductor #Packaging #Chiplet #HBM #Underfill #TIM #SemiconductorProcess -------------------------------------------------------------------------------------------------- In the era of AI semiconductors, packaging powerhouses lead the market: DIELEC 『2024 Advanced Semiconductor Package Innovation Technology Conference』 April 24, 2024 (Wed) 10:00 ~ 17:00 COEX Conference Room 307 (513 Yeongdong-daero, Gangnam-gu, Seoul) (https://yelec.kr/product/thelecadvanc...) [Offline Event Overview] Event Name: 2024 Advanced Semiconductor Package Innovation Technology Conference Date: April 24, 2024 (Wed) 10:00 ~ 17:00 Venue: COEX Conference Room 307 (513 Yeongdong-daero, Gangnam-gu, Seoul) Host/Organizer: DIELEC / YELEC Size: First-come-first-served 100 people Participation Fee: Pre-registration 440,000 won (VAT included) Registration Deadline: April 23, 2024 (Tue) 18:00 (No on-site registration possible in case of early closing) Event inquiries: The Lec Director Kim Sang-soo [email protected] 010 5278 5958 [Note] ◦ The seminar room may close early due to limited capacity. ◦ On-site attendees can enter in advance starting at 9:00. ◦ Presentation materials will be provided in file format only to speakers who have permitted their disclosure. ◦ When depositing the conference fee, please deposit under the company name or the registrant’s name. (Woori Bank 1005 – 803 – 563727 Depositor: The Lec) *Presentation topics and speakers are subject to change. *Tax invoices can only be issued by bank transfer. ◦ Confirmation of participation – Please apply after the conference ends. ◦ Cancellation information – Refunds can be applied for up to 2 days before the event. No refunds will be possible after that. – Individual parking is not supported. -------------------------------------------------------------------------------------------------- ※ Dielec Membership Membership Guide ( • Dielec YouTube membership has been opened. ) Membership registration ( / @theelec9812 ) ※ Dielec Membership Benefits [Watch Dielec videos as soon as possible] Dielec live videos and content are basically all 'free', but live replays are provided exclusively for membership members. Dielec, a media specializing in electronic components