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The core of future semiconductor technology... The role and prospects of hybrid bonding ※ This is the broadcast version for Monday, May 20, 2024. English: 00:00 Intro 00:26 What is hybrid bonding? 02:21 Why hybrid bonding is necessary? 06:08 Scope of hybrid bonding 07:50 Impact of changes in process methods 09:06 Pros and cons of the collaboration model and current technology landscape 13:57 Impact of introducing bumpless methods 18:19 Outlook for hybrid bonding 19:06 Domestic companies preparing to introduce hybrid bonding technology #Semiconductor #HBM4 #Foundry #Samsung Electronics #SK Hynix #Hybrid bonding #Lee Se-cheol #Citigroup -------------------------------------------------------------------------------------------------- ASSIC2024 Advanced Space Semiconductor Innovation Conference (Free): May 30, 2024, Thursday, 09:00 ~ 17:00 Gwanggyo Hall, 1st floor, Gyeonggi Economic and Science Promotion Agency (https://yelec.kr/product/assic2024/) [Offline event overview] Event name: 『Advanced Space Semiconductor Innovation Conference (ASSIC) 2024』 Date: Thursday, May 30, 2024, 09:00 ~ 17:00 Venue: Gwanggyo Hall on the 1st floor of Gyeonggi Economic and Science Promotion Agency (Gwanggyo Techno Valley) Size: 200 participants: Executives and staff from the public, private, industrial, academic, and research sectors related to space semiconductors Cost of participation: Free Host: Thelec / QRT Organizer: YELEC / Korea Semiconductor Research Association Sponsor: Korea Semiconductor Industry Association / Korea Fabless Industry Association Event inquiries: Thelec Director Kim Sang-soo [email protected] 010 5278 5958 -------------------------------------------------------------------------------------------------- ※ Thelec Membership Membership Information ( • Theelec YouTube membership has been opened. ) Sign up for membership ( / @theelec9812 ) ※ Theelec Membership Benefits [Quickly watch the Theelec video] Theelec live video and All content is basically 'free', but live replays are available exclusively to membership members.