Analysis of the supply chain of glass substrates for semiconductor packaging 00:00 Intro 00:30 YC Chem stock price increase and announcement of glass substrate technology for semiconductors 01:13 Absolix and SKC, Samsung Electro-Mechanics' entry into the glass substrate market 02:20 Potential market expandability of glass substrates 02:33 Intel's glass substrate introduction plan and benefits 04:05 Glass substrate characteristics and market transition potential 04:30 Ajinomoto mentioned as a potential victim of the glass substrate market 05:40 Technical details of glass substrates and TGV process 06:01 Status of additional companies participating in the development of glass substrate technology 07:06 Technological challenges and directions for improvement 08:08 The role of glass substrates in the era of NVIDIA and AI 09:11 Interpretation of price competitiveness and market adaptation issues of glass substrates 10:34 Technological advancement and market outlook of glass substrates 11:32 Companies' response strategies and readiness status according to market changes #Semiconductor #Package #GlassSubstrate #GlassSubstrate #Intel #YChem #SamsungElectrics #Absolix #SKC -------------------------------------------------------------------------------------------------- In the era of AI semiconductors, packaging powerhouses lead the market: The Elec 『2024 Advanced Semiconductor Package Innovation Technology Conference』 April 24, 2024 (Wed) 10:00 ~ 17:00 COEX Conference Room 307 (513 Yeongdong-daero, Gangnam-gu, Seoul) (https://yelec.kr/product/thelecadvanc...) [Offline Event Overview] Event Name: 2024 Advanced Semiconductor Package Innovation Technology Conference Date: April 24, 2024 (Wed) 10:00 ~ 17:00 Venue: COEX Conference Room 307 (513 Yeongdong-daero, Gangnam-gu, Seoul) Host/Organizer: The Elec / The Elec Scale: First-come, first-served basis, 100 people Participation fee: Pre-registration 440,000 won (VAT included) Registration deadline: Tuesday, April 23, 2024, 6:00 PM (On-site registration not possible in case of early closing) Event inquiries: The Lec Director Kim Sang-soo [email protected] 010 5278 5958 [Note] ◦ Early closing may occur due to limited capacity in the seminar room. ◦ On-site attendees can enter in advance starting at 9:00 AM. ◦ Presentation materials will be provided in file format only for speakers who have permitted their disclosure. ◦ When depositing the conference fee, please deposit under the company name or the registrant's name. (Woori Bank 1005 – 803 – 563727, Depositor: The Lec) *Presentation topics and speakers are subject to change. *Tax invoices can only be issued via bank transfer. ◦ Confirmation of participation – Please apply after the conference ends. ◦ Cancellation information - Refunds can be requested up to 2 days before the event. No refunds will be made thereafter. - Individual parking is not supported. -------------------------------------------------------------------------------------------------- ※ Dielec Membership Membership Information ( • Dielec YouTube membership has been opened. ) Sign up for membership ( / @theelec9812 ) ※ Dielec Membership Benefits [Watch Dielec videos as soon as possible] Dielec live videos and content are basically all 'free', but live replays are provided exclusively for membership members. Dielec, a specialized electronic components media